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Home > Physics > About us > Facilities > Fabrication > Nanofabrication
More in this section Fabrication


Scanning electron microscope

JEOL 6460 SEM Scanning Electron Microscope combined with Nanomaker writing system. It is equipped with both secondary and backscatterd electrons detectors for imaging. A resolution 5 nm can be achieved at the maximum accelerating voltage of 30 kV and low probe current. SEM equipped with electrostatic beam blanker and integrated with Nanomaker beam writer system. It converts SEM to Electron Beam Lithograph. Semiautomatic mark detection with high precision alignment is available. The probe current is accurately measured by picoammeter. Easy to use pattern generator includes proximity correction and development simulation tools.

Ultra high vacuum system


UHV system built by Kurt J. Lesker. It consists of two vacuum chambers with transfer gate. It is able to achieve ultrahigh vacuum and equipped with electron beam source and thermal sources. In situ etching with ion gun is available.










Electron beam evaporator


Edwards 500 electron beam evaporation system. Includes thermal evaporation sources. Ion gun for in situ ion etching installed in Extension mini-chamber. Set up for variety of materials. Both automatic and manual evaporation regimes are available.










Reactive Ion Etching system


Plasmalab 80plus Reactive Ion Etching system build by Oxford Instrument. Equipped with laser interferometer end point detector. Oxygen, Argon, SF6, CF4, CHF3 set of gases provides variety of processes for different materials.














Probe station

It is important to be able to test electrical properties of nanostructures within the clean room, before you bond your structure or mount it in cryostat. High precision manipulator probes are connected to voltmeter-source. Probe leads can be manipulated to make contact to microstructures under optical microscope. Current-Voltage characteristics of nanostructures are measured and recorded by computer program.

Bonder and profilemeter


Wire bonder. Many of research projects in our group include transport measurements at low temperatures. Wire bonder is used to connect samples to standard package circuits or sample holders. Thin Al or Au wire can be attached to contact pads of few hundred microns size under optical microscope. The Alpha- Step IQ is a state-of-the-art, stylus-based surface profiler that combines high measurement precision with versatility. It is one of the busiest pieces of equipment in our nanolab. It provides quick measurements of profile with accurate measurement of thickness. It is widely used to develop various etching and deposition processes.


Fabrication facilities

Research facilities


Nano fabrication

  • SEM
  • UHV System
  • E-beam evaporator
  • RIE system
  • Probe station
  • Bonder and profilemeter

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